Inventor

LAU KAM CHUAN

MY4 patents

⚠️ This page may combine multiple inventors who share the name “LAU KAM CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CARSEM M SDN BHD

2 patents

US7846774B2Dec 7, 2010

Multiple row exposed leads for MLP high density packages

CARSEM M SDN BHD15 citations76

US7351611B2Apr 1, 2008

Method of making the mould for encapsulating a leadframe package

CARSEM M SDN BHD8 citations63

CARSEM (M) SDN BHD

1 patent

US9691688B2Jun 27, 2017

Thin plastic leadless package with exposed metal die paddle

CARSEM (M) SDN BHD0 citations45

YEE MOW LUM

1 patent

US9190385B2Nov 17, 2015

Thin plastic leadless package with exposed metal die paddle

YEE MOW LUM1 citations39