Inventor

HOINKIS MARK D

US6 patents

⚠️ This page may combine multiple inventors who share the name “HOINKIS MARK D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES CORP

2 patents

US6218298B1Apr 17, 2001

Tungsten-filled deep trenches

INFINEON TECHNOLOGIES CORP73 citations93

US6146517ANov 14, 2000

Integrated circuits with copper metallization for interconnections

INFINEON TECHNOLOGIES CORP71 citations93

IBM

2 patents

US9484220B2Nov 1, 2016

Sputter etch processing for heavy metal patterning in integrated circuits

IBM6 citations72

US9171796B1Oct 27, 2015

Sidewall image transfer for heavy metal patterning in integrated circuits

IBM5 citations71

INFINEON TECHNOLOGIES AG

1 patent

US6864171B1Mar 8, 2005

Via density rules

INFINEON TECHNOLOGIES AG13 citations80

UNITED MICROELECTRONICS CO

1 patent

US6960835B2Nov 1, 2005

Stress-relief layer for semiconductor applications

UNITED MICROELECTRONICS CO4 citations59