Inventor

CHIOU KUO-CHAN

TW26 patents

⚠️ This page may combine multiple inventors who share the name “CHIOU KUO-CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIOU KUO-CHAN

IND TECH RES INST

Polymers and resin composition employing the same

Resin formulations, resin polymers and composite materials comprising the resin polymers

Polyamide-imides, graphite films and preparation for the graphite film

Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same

Resin composition and method for manufacturing thermally conductive material

Composition for thermal interface material

Modified bismaleimide resins, preparation method thereof and compositions comprising the same

Method for degradating thermosetting resin, catalyst composition used therein and resin composition obtained thereby

Furan-modified compound and oligomer

Modified copolymer, method for preparing the same, and method for preparing paste

Transparent conductive film composite and transparent conductive film

Reversible crosslinking reactant composition

Reversible crosslinking reactant composition

Conductive paste composition and method for manufacturing electrode

Thermally conductive resin and thermal interface material comprising the same

Epoxy resin compositions and thermal interface materials comprising the same

Thermally conductive resin, resin composition, prepreg, and copper clad laminate

Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition

CHIOU KUO-CHAN

Graphite oxide-containing resin formulation, composition, and composite thereof

Conductive pastes

LIAO LU-SHIH

Low dielectric constant resin formulation, prepolymer, composition, and composite thereof

Halogen-free and phosphorus-free resin formulation and composite materials prepared therefrom

LIN CHEN-LUNG

Electrically insulating and thermally conductive composition and electronic device

LU CHUN-AN

Method for forming nanometer scale dot-shaped materials

LEE TZONG-MING

Method for manufacturing a substrate with surface structure by employing photothermal effect

KUAN MIN-TSUNG

Encapsulation material