P

Inventor

HANG KENNETH WARREN

US80 patents
⚠️ This page may combine multiple inventors who share the name “HANG KENNETH WARREN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DU PONT

31 patents
US7494607B2Feb 24, 2009

Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom

DU PONT94 citations98
US7435361B2Oct 14, 2008

Conductive compositions and processes for use in the manufacture of semiconductor devices

DU PONT44 citations96
US10069020B2Sep 4, 2018

Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices

DU PONT8 citations92
US9722100B2Aug 1, 2017

Thick-film pastes containing lead-tellurium-lithium-oxides, and their use in the manufacture of semiconductor devices

DU PONT12 citations92
US7462304B2Dec 9, 2008

Conductive compositions used in the manufacture of semiconductor device

DU PONT20 citations92
US6776861B2Aug 17, 2004

Tape composition and process for internally constrained sintering of low temperature co-fired ceramic

DU PONT40 citations90
US7556748B2Jul 7, 2009

Method of manufacture of semiconductor device and conductive compositions used therein

DU PONT22 citations89
US8383017B2Feb 26, 2013

Conductive compositions and processes for use in the manufacture of semiconductor devices

DU PONT11 citations84
US7030048B2Apr 18, 2006

Thick film dielectric compositions for use on aluminum nitride substrates

DU PONT11 citations84
US6835682B2Dec 28, 2004

High thermal expansion glass and tape composition

DU PONT17 citations84
US7780878B2Aug 24, 2010

Lead-free conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive

DU PONT16 citations83
US7771623B2Aug 10, 2010

Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof

DU PONT10 citations83
US7068492B2Jun 27, 2006

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

DU PONT12 citations83
US7906045B2Mar 15, 2011

Method of manufacture of semiconductor device and conductive compositions used therein

DU PONT7 citations80
US7935277B2May 3, 2011

Conductive compositions and processes for use in the manufacture of semiconductor devices

DU PONT4 citations74
US7087293B2Aug 8, 2006

Thick film dielectric compositions for use on aluminum nitride substrates

DU PONT5 citations74
US6841493B2Jan 11, 2005

High K glass and tape composition for use at high frequency

DU PONT10 citations74
US9023254B2May 5, 2015

Thick film silver paste and its use in the manufacture of semiconductor devices

DU PONT4 citations73
US7790065B2Sep 7, 2010

Conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive

DU PONT5 citations73
US7067026B2Jun 27, 2006

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

DU PONT7 citations73
US7951311B2May 31, 2011

Non-lead resistor composition

DU PONT5 citations72
US7687417B2Mar 30, 2010

Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom

DU PONT7 citations72
US7608206B1Oct 27, 2009

Non-lead resistor composition

DU PONT6 citations72
US6827800B2Dec 7, 2004

Process for the constrained sintering of asymmetrically configured dielectric layers

DU PONT8 citations71
US10134925B2Nov 20, 2018

Conductive paste composition and semiconductor devices made therewith

DU PONT2 citations68
US9087937B2Jul 21, 2015

Glass composition and its use in conductive silver paste

DU PONT2 citations63
US11043605B2Jun 22, 2021

Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices

DU PONT0 citations62
US7998371B2Aug 16, 2011

Conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive

DU PONT4 citations62
US7740725B2Jun 22, 2010

Thick film conductor paste composition for LTCC tape in microwave applications

DU PONT2 citations62
US7175724B2Feb 13, 2007

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

DU PONT6 citations62
US7048993B2May 23, 2006

Process for the constrained sintering of asymmetrically configured dielectric layers

DU PONT5 citations62

CARROLL ALAN FREDERICK

8 patents

HANG KENNETH WARREN

5 patents

DUPONT ELECTRONICS INC

2 patents

RCA CORP

2 patents

ANDERSON RUSSELL DAVID

1 patent

WANG YUELI Y

1 patent

Showing the top 50 of 80 patents by PatentIndex Score.