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Inventor

BROWN KARL M

US33 patents
⚠️ This page may combine multiple inventors who share the name “BROWN KARL M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

13 patents
US7244344B2Jul 17, 2007

Physical vapor deposition plasma reactor with VHF source power applied through the workpiece

APPLIED MATERIALS INC34 citations96
US7214619B2May 8, 2007

Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece

APPLIED MATERIALS INC36 citations92
US7399943B2Jul 15, 2008

Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece

APPLIED MATERIALS INC9 citations84
US7804040B2Sep 28, 2010

Physical vapor deposition plasma reactor with arcing suppression

APPLIED MATERIALS INC10 citations79
US7820020B2Oct 26, 2010

Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas

APPLIED MATERIALS INC4 citations74
US10648074B2May 12, 2020

Physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surface

APPLIED MATERIALS INC2 citations73
US9518326B2Dec 13, 2016

Method for forming an electrostatic chuck using film printing technology

APPLIED MATERIALS INC5 citations73
US9871240B2Jan 16, 2018

Electrospinning for integrated separator for lithium-ion batteries

APPLIED MATERIALS INC2 citations71
US11049761B2Jun 29, 2021

Shutter disk for physical vapor deposition chamber

APPLIED MATERIALS INC1 citations62
US7268076B2Sep 11, 2007

Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece

APPLIED MATERIALS INC6 citations62
US10400328B2Sep 3, 2019

Physical vapor deposition system with a source of isotropic ion velocity distribution at the wafer surface

APPLIED MATERIALS INC0 citations52
US10468292B2Nov 5, 2019

Shutter disk for physical vapor deposition chamber

APPLIED MATERIALS INC0 citations51
US7541289B2Jun 2, 2009

Process for removing high stressed film using LF or HF bias power and capacitively coupled VHF source power with enhanced residue capture

APPLIED MATERIALS INC1 citations51

APPLE INC

6 patents

BROWN KARL M

5 patents

HOFFMAN DANIEL J

3 patents

PRESTOLITE WIRE CORP

2 patents

SHANG QUANYUAN

2 patents

SANSONI STEVEN V

1 patent

ORILALL MAHENDRA C

1 patent