Inventor
FULFORD DANIEL
US21 patents
Patents
21 patentsUS10453692B2Oct 22, 2019
Location-specific tuning of stress to control bow to control overlay in semiconductor processing
TOKYO ELECTRON LTD9 citations83
US10431468B2Oct 1, 2019
Location-specific tuning of stress to control bow to control overlay in semiconductor processing
TOKYO ELECTRON LTD8 citations83
US9646898B2May 9, 2017
Methods for treating a substrate by optical projection of a correction pattern based on a detected spatial heat signature of the substrate
TOKYO ELECTRON LTD4 citations73
US9977339B2May 22, 2018
System and method for shifting critical dimensions of patterned films
TOKYO ELECTRON LTD3 citations72
US10923363B1Feb 16, 2021
Method for increasing pattern density on a wafer
TOKYO ELECTRON LTD3 citations71
US12276922B2Apr 15, 2025
Backside deposition tuning of stress to control wafer bow in semiconductor processing
TOKYO ELECTRON LTD1 citations63
US12341053B2Jun 24, 2025
System for backside deposition of a substrate
TOKYO ELECTRON LTD0 citations62
US11908728B2Feb 20, 2024
System for backside deposition of a substrate
TOKYO ELECTRON LTD0 citations62
US11854806B2Dec 26, 2023
Method for pattern reduction using a staircase spacer
TOKYO ELECTRON LTD0 citations62
US11776812B2Oct 3, 2023
Method for pattern reduction using a staircase spacer
TOKYO ELECTRON LTD0 citations62
US11393694B2Jul 19, 2022
Method for planarization of organic films
TOKYO ELECTRON LTD0 citations62
US11201051B2Dec 14, 2021
Method for layer by layer growth of conformal films
TOKYO ELECTRON LTD0 citations62
US12581898B2Mar 17, 2026
Device and method for determining wafer bow
TOKYO ELECTRON LTD0 citations52
US11883837B2Jan 30, 2024
System and method for liquid dispense and coverage control
TOKYO ELECTRON LTD0 citations52
US9735067B2Aug 15, 2017
Substrate tuning system and method using optical projection
TOKYO ELECTRON LTD1 citations52
US11990334B2May 21, 2024
Method for tuning stress transitions of films on a substrate
TOKYO ELECTRON LTD0 citations51
US11841617B2Dec 12, 2023
Method of forming a narrow trench
TOKYO ELECTRON LTD0 citations51
US11656550B2May 23, 2023
Controlling semiconductor film thickness
TOKYO ELECTRON LTD0 citations51
US11335566B2May 17, 2022
Method for planarization of spin-on and CVD-deposited organic films
TOKYO ELECTRON LTD0 citations51
US12381118B2Aug 5, 2025
3D multiple location compressing bonded arm for advanced integration
TOKYO ELECTRON LTD0 citations50
US12435964B2Oct 7, 2025
Contactless capacitive measurement tool with improved throughput and accuracy
TOKYO ELECTRON LTD0 citations49