Inventor
MARRS ROBERT C
US13 patents
⚠️ This page may combine multiple inventors who share the name “MARRS ROBERT C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR ELECTRONICS INC
11 patentsUS5355283AOct 11, 1994
Ball grid array with via interconnection
AMKOR ELECTRONICS INC568 citations99
US5701034ADec 23, 1997
Packaged semiconductor die including heat sink with locking feature
AMKOR ELECTRONICS INC325 citations98
US5485037AJan 16, 1996
Semiconductor device having a thermal dissipator and electromagnetic shielding
AMKOR ELECTRONICS INC174 citations98
US5478007ADec 26, 1995
Method for interconnection of integrated circuit chip and substrate
AMKOR ELECTRONICS INC154 citations98
US5583378ADec 10, 1996
Ball grid array integrated circuit package with thermal conductor
AMKOR ELECTRONICS INC290 citations96
US5483100AJan 9, 1996
Integrated circuit package with via interconnections formed in a substrate
AMKOR ELECTRONICS INC45 citations96
US5482898AJan 9, 1996
Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
AMKOR ELECTRONICS INC84 citations96
US5455462AOct 3, 1995
Plastic molded package with heat sink for integrated circuit devices
AMKOR ELECTRONICS INC48 citations96
US5328870AJul 12, 1994
Method for forming plastic molded package with heat sink for integrated circuit devices
AMKOR ELECTRONICS INC51 citations96
US5722161AMar 3, 1998
Method of making a packaged semiconductor die including heat sink with locking feature
AMKOR ELECTRONICS INC43 citations92
US5378869AJan 3, 1995
Method for forming an integrated circuit package with via interconnection
AMKOR ELECTRONICS INC41 citations92