Inventor

LEE WEI TI

US35 patents

⚠️ This page may combine multiple inventors who share the name “LEE WEI TI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE WEI TI

APPLIED MATERIALS INC

Plasma-enhanced chemical vapor deposition of a metal nitride layer

Liner materials

Deposition processes for titanium nitride barrier and aluminum

Aluminum contact integration on cobalt silicide junction

Ampoule splash guard apparatus

CVD-PVD deposition process

Aluminum sputtering while biasing wafer

Unique passivation technique for a CVD blocker plate to prevent particle formation

Gas line weldment design and process for CVD aluminum

NOVA MEASURING INSTR INC

Method and system for non-destructive metrology of thin layers

Feed-forward of multi-layer and multi-process information using XPS and XRF technologies

Feed-forward of multi-layer and multi-process information using XPS and XRF technologies

Method and system for non-destructive metrology of thin layers

Method and system for non-destructive metrology of thin layers

XPS metrology for process control in selective deposition

Characterizing and measuring in small boxes using XPS with multiple measurements

Characterizing and measuring in small boxes using XPS with multiple measurements

XPS metrology for process control in selective deposition

LEE WEI TI

Resistive switching devices having a buffer layer and methods of formation thereof

Resistive switching devices having alloyed electrodes and methods of formation thereof

Gas line weldment design and process for CVD aluminum

ADESTO TECHNOLOGIES CORP

Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereof

Solid electrolyte memory elements with electrode interface for improved performance

Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereof

POIS HEATH A

Silicon germanium thickness and composition determination using combined XPS and XRF technologies

Silicon germanium thickness and composition determination using combined XPS and XRF technologies

APPILED MATERIALS INC

Ampoule splash guard apparatus

SHIELDS JEFFREY ALLAN

Programmable memory elements, devices and methods having physically localized structure

GANGULI SESHADRI

Metal gate structures and methods for forming thereof

LEE SANG-HYEOB

Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance

REVERA INCORPORATED

Feed-forward of multi-layer and multi-process information using XPS and XRF technologies

NOVA LTD

Method and system for non-destructive metrology of thin layers

IBM

Hybridization for characterization and metrology

CROSSBAR INC

Resistive switching memory having confined filament formation and methods thereof

KIM HOON

Methods for forming barrier/seed layers for copper interconnect structures