Inventor
LAU DANIEL K
US4 patents
⚠️ This page may combine multiple inventors who share the name “LAU DANIEL K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED INTERCONNECT TECH LTD
3 patentsUS7259445B2Aug 21, 2007
Thermal enhanced package for block mold assembly
ADVANCED INTERCONNECT TECH LTD101 citations91
US7247933B2Jul 24, 2007
Thin multiple semiconductor die package
ADVANCED INTERCONNECT TECH LTD16 citations82
US7489021B2Feb 10, 2009
Lead frame with included passive devices
ADVANCED INTERCONNECT TECH LTD17 citations78