Inventor · disambiguated record
Alexander Von Glasow
Also filed as: VON GLASOW ALEXANDER
10 granted patents·1 pending application·61 citations·filing 2003–2015
87Inventor score
Top patents by PatentIndex Score
11 records- 0187US8138539B2Semiconductor devices and methods of manufacture thereofBARTH HANS-JOACHIM·Filed 2007·Granted Mar 20, 2012·14 cites·25 claims
- 0286US7777300B2Semiconductor device with capacitorINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 17, 2010·16 cites·52 claims
- 0372US8323991B2Method for detecting stress migration propertiesFISCHER ARMIN·Filed 2010·Granted Dec 4, 2012·3 cites·7 claims
- 0468US7888672B2Device for detecting stress migration propertiesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 15, 2011·3 cites·18 claims
- 0565US6940720B2Integrated circuit having a thermally shielded electric resistor traceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 6, 2005·12 cites·16 claims
- 0662US8569820B2Capacitor having a plurality of parallel conductive membersBARTH HANS-JOACHIM·Filed 2012·Granted Oct 29, 2013·1 cites·27 claims
- 0762US7919363B2Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 5, 2011·2 cites·24 claims
- 0857US7327152B2Integrated test circuit arrangement and test methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Feb 5, 2008·6 cites·21 claims
- 0950US7315998B2Integrated circuit arrangement with intermediate materials and associated componentsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jan 1, 2008·4 cites·11 claims
- 1047US8487453B2Integrated circuit with pads connected by an under-bump metallization and method for production thereofFISCHER ARMIN·Filed 2011·Granted Jul 16, 2013·0 cites·19 claims
- 1131US2015228436A1Fuses and fuse programming methodsINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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