Inventor
WU PING-CHANG
TW12 patents
⚠️ This page may combine multiple inventors who share the name “WU PING-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
10 patentsUS7387950B1Jun 17, 2008
Method for forming a metal structure
UNITED MICROELECTRONICS CORP31 citations92
US7382038B2Jun 3, 2008
Semiconductor wafer and method for making the same
UNITED MICROELECTRONICS CORP14 citations82
US7649268B2Jan 19, 2010
Semiconductor wafer
UNITED MICROELECTRONICS CORP4 citations62
US8039367B2Oct 18, 2011
Scribe line structure and method for dicing a wafer
UNITED MICROELECTRONICS CORP5 citations61
US7795704B2Sep 14, 2010
Die seal ring and wafer having the same
UNITED MICROELECTRONICS CORP6 citations61
US7485953B2Feb 3, 2009
Chip package structure
UNITED MICROELECTRONICS CORP4 citations61
US9190359B2Nov 17, 2015
Scribe line structure for wafer dicing and method of making the same
UNITED MICROELECTRONICS CORP0 citations51
US8013425B2Sep 6, 2011
Scribe line structure for wafer dicing and method of making the same
UNITED MICROELECTRONICS CORP0 citations51
US7696606B2Apr 13, 2010
Metal structure
UNITED MICROELECTRONICS CORP0 citations51
US8030778B2Oct 4, 2011
Integrated circuit structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations50