Inventor · disambiguated record

Beng Kuan Lim

Also filed as: LIM BENG KUAN

1 granted patent·4 citations·filing 2005–2005

24Inventor score

Technology areasH10W

Files withUNITED TEST & ASSEMBLY CT LTD1

Top patents by PatentIndex Score

1 record

0165US7830006B2Structurally-enhanced integrated circuit package and method of manufactureUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Granted Nov 9, 2010·4 cites·10 claims

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