Inventor
ZHANG XUEREN
SG14 patents
⚠️ This page may combine multiple inventors who share the name “ZHANG XUEREN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS PTE LTD
6 patentsUS9449912B1Sep 20, 2016
Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
ST MICROELECTRONICS PTE LTD11 citations82
US9576912B1Feb 21, 2017
Wafer level chip scale package (WLCSP) having edge protection
ST MICROELECTRONICS PTE LTD4 citations71
US10658238B2May 19, 2020
Semiconductor packages having an electric device with a recess
ST MICROELECTRONICS PTE LTD0 citations51
US9824924B2Nov 21, 2017
Semiconductor packages having an electric device with a recess
ST MICROELECTRONICS PTE LTD0 citations51
US9379034B1Jun 28, 2016
Method of making an electronic device including two-step encapsulation and related devices
ST MICROELECTRONICS PTE LTD1 citations51
US9679870B2Jun 13, 2017
Integrated circuit device with shaped leads and method of forming the device
ST MICROELECTRONICS PTE LTD0 citations36
ZHANG XUEREN
3 patentsUS8772943B2Jul 8, 2014
Offset of contact opening for copper pillars in flip chip packages
ZHANG XUEREN7 citations82
US8800391B2Aug 12, 2014
Piezo-resistive force sensor with bumps on membrane structure
ZHANG XUEREN8 citations80
US8796826B2Aug 5, 2014
Window clamp top plate for integrated circuit packaging
ZHANG XUEREN2 citations58