Inventor

TEE TONG YAN

SG9 patents

⚠️ This page may combine multiple inventors who share the name “TEE TONG YAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEE TONG YAN

2 patents

US8486824B2Jul 16, 2013

Enhancing metal/low-K interconnect reliability using a protection layer

TEE TONG YAN11 citations77

US8217518B2Jul 10, 2012

Enhancing metal/low-K interconnect reliability using a protection layer

TEE TONG YAN2 citations56

ST MICROELECTRONICS INC

2 patents

US7196425B2Mar 27, 2007

Copper interposer for reducing warping of integrated circuit packages and method of making IC packages

ST MICROELECTRONICS INC2 citations61

US8524531B2Sep 3, 2013

System and method for improving solder joint reliability in an integrated circuit package

ST MICROELECTRONICS INC0 citations51

ST MICROELECTRONICS ASIA

1 patent

US8018036B2Sep 13, 2011

Ultra-thin quad flat no-lead (QFN) package

ST MICROELECTRONICS ASIA18 citations91

ZHANG XUEREN

1 patent

US8800391B2Aug 12, 2014

Piezo-resistive force sensor with bumps on membrane structure

ZHANG XUEREN8 citations80

GOH KIM-YONG

1 patent

US8642396B2Feb 4, 2014

Ultra-thin quad flat no-lead (QFN) package

GOH KIM-YONG1 citations50

CHIU ANTHONY M

1 patent

US8330258B2Dec 11, 2012

System and method for improving solder joint reliability in an integrated circuit package

CHIU ANTHONY M0 citations49

WANG SHANZHONG

1 patent

US8592980B2Nov 26, 2013

Carbon nanotube-modified low-K materials

WANG SHANZHONG0 citations42