Inventor

OTREMBA RALF

DE251 patents

⚠️ This page may combine multiple inventors who share the name “OTREMBA RALF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OTREMBA RALF

INFINEON TECHNOLOGIES AG

Semiconductor device with a number of bonding leads and method for producing the same

Electronic component having at least two semiconductor power devices

Device including two power semiconductor chips and manufacturing thereof

Semiconductor device

Electronic component and method for manufacturing an electronic component

Method of fabricating a power electronic device

Device with a plurality of semiconductor chips

Power semiconductor device connected in distinct layers of plastic

Semiconductor component and methods to produce a semiconductor component

Semiconductor module

Method of producing an electronic component

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Electronic component having exposed surfaces

Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Electronic component having at least one vertical semiconductor power transistor

Electronic component and method for its assembly

Electronic module and method of assembling the same

Semiconductor module

Semiconductor module

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

Stacked semiconductor chips with separate encapsulations

Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards

Printed circuit boards and methods of manufacturing thereof

Semiconductor device

Power semiconductor device and method for its production

Power transistor and power semiconductor device

Power semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device

Electronic device and method of manufacturing same

Power semiconductor device having lines within a housing

Semiconductor device and method for producing the same

OTREMBA RALF

Multi-chip package and method of manufacturing thereof

Device including two power semiconductor chips and manufacturing thereof

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Semiconductor device including a contact clip having protrusions and manufacturing thereof

Semiconductor module

Power semiconductor chip package

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Semiconductor device and method for producing the same

Semiconductor module with multiple semiconductor chips

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Electronic device having contact elements with a specified cross section and manufacturing thereof

Multi-chip module

Device including two mounting surfaces

Electronic device

INFINEON TECHNOLOGIES AUSTRIA AG

Multi-chip semiconductor power device

Electronic component and method

INFIEON TECHNOLOGIES A G

Electronic module with stacked semiconductors

INFINEON TECHNOLOGIES AUSTRIA

Switching circuit

QIMONDA AG

Multi-chip module