Inventor · disambiguated record
Bruce Euzent
Also filed as: EUZENT BRUCE
4 granted patents·68 citations·filing 2003–2010
79Inventor score
Top patents by PatentIndex Score
4 records- 0194US7585702B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2005·Granted Sep 8, 2009·38 cites·12 claims
- 0282US8212353B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateWANG WEN-CHOU VINCENT·Filed 2010·Granted Jul 3, 2012·8 cites·14 claims
- 0382US7741160B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2009·Granted Jun 22, 2010·9 cites·6 claims
- 0463US7210081B1Apparatus and methods for assessing reliability of assemblies using programmable logic devicesALTERA CORP·Filed 2003·Granted Apr 24, 2007·13 cites·55 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →