P

Inventor

OKUDA KAZUYUKI

JP39 patents
⚠️ This page may combine multiple inventors who share the name “OKUDA KAZUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI INT ELECTRIC INC

15 patents
US6905549B2Jun 14, 2005

Vertical type semiconductor device producing apparatus

HITACHI INT ELECTRIC INC60 citations96
US7900580B2Mar 8, 2011

Substrate processing apparatus and reaction container

HITACHI INT ELECTRIC INC27 citations92
US7779785B2Aug 24, 2010

Production method for semiconductor device and substrate processing apparatus

HITACHI INT ELECTRIC INC21 citations92
US9218955B2Dec 22, 2015

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

HITACHI INT ELECTRIC INC7 citations84
US8956984B2Feb 17, 2015

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC15 citations84
US8047158B2Nov 1, 2011

Substrate processing apparatus and reaction container

HITACHI INT ELECTRIC INC8 citations84
US8039404B2Oct 18, 2011

Production method for semiconductor device

HITACHI INT ELECTRIC INC9 citations84
US9895727B2Feb 20, 2018

Method of manufacturing semiconductor device, method of cleaning interior of process chamber, substrate processing apparatus, and recording medium

HITACHI INT ELECTRIC INC3 citations73
USD791091SJul 4, 2017

Pattern wafer

HITACHI INT ELECTRIC INC5 citations73
US9177786B2Nov 3, 2015

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium

HITACHI INT ELECTRIC INC5 citations73
US9593422B2Mar 14, 2017

Substrate processing apparatus and semiconductor device manufacturing method

HITACHI INT ELECTRIC INC2 citations71
US8366868B2Feb 5, 2013

Substrate processing apparatus

HITACHI INT ELECTRIC INC4 citations63
US7622396B2Nov 24, 2009

Method of producing a semiconductor device

HITACHI INT ELECTRIC INC2 citations63
US9349587B2May 24, 2016

Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatus

HITACHI INT ELECTRIC INC0 citations52
US9963785B2May 8, 2018

Substrate processing apparatus and semiconductor device manufacturing method

HITACHI INT ELECTRIC INC0 citations50

KOKUSAI ELECTRIC CORP

11 patents
US10640869B2May 5, 2020

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP3 citations73
US11705325B2Jul 18, 2023

Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP1 citations71
US12550640B2Feb 10, 2026

Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US12142476B2Nov 12, 2024

Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US11972934B2Apr 30, 2024

Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US11527401B2Dec 13, 2022

Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US12266522B2Apr 1, 2025

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations60
US11915927B2Feb 27, 2024

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations60
US11361961B2Jun 14, 2022

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP1 citations60
US12288683B2Apr 29, 2025

Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations51
US12148611B2Nov 19, 2024

Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations50

MIYA HIRONOBU

2 patents

OKUDA KAZUYUKI

2 patents

MIZUNO NORIKAZU

2 patents

OTA YOSUKE

1 patent

KONTANI TADASHI

1 patent

MAZDA MOTOR

1 patent

DENSO CORP

1 patent

NIPPON DENSO CO

1 patent

SAKAI MASANORI

1 patent

ASAI MASAYUKI

1 patent