Inventor · disambiguated record

Hongin Jiang

Also filed as: JIANG HONGIN

1 granted patent·8 citations·filing 2012–2012

30Inventor score

Technology areasH10W

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0178US9960105B2Controlled solder height packages and assembly processesINTEL CORP·Filed 2012·Granted May 1, 2018·8 cites·13 claims

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