Inventor

ISMAIL HAMDAN

MY3 patents

⚠️ This page may combine multiple inventors who share the name “ISMAIL HAMDAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NXP USA INC

2 patents

US12087671B2Sep 10, 2024

Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

NXP USA INC0 citations53

US10998255B2May 4, 2021

Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

NXP USA INC0 citations53

FREESCALE SEMICONDUCTOR INC

1 patent

US9607953B1Mar 28, 2017

Semiconductor package with isolation wall

FREESCALE SEMICONDUCTOR INC17 citations78