Inventor
MANOHARAN ARUNA
US3 patents
Patents
3 patentsUS12087671B2Sep 10, 2024
Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
NXP USA INC0 citations53
US10998255B2May 4, 2021
Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
NXP USA INC0 citations53
US10134660B2Nov 20, 2018
Semiconductor device having corrugated leads and method for forming
NXP USA INC0 citations37