Inventor

WANG LIANG

CN504 patents

⚠️ This page may combine multiple inventors who share the name “WANG LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG LIANG

INVENSAS CORP

Direct-bonded LED structure contacts and substrate contacts

Structures and methods for reliable packages

Making electrical components in handle wafers of integrated circuit packages

Structures and methods for reliable packages

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Multichip modules and methods of fabrication

Microelectronic assemblies with cavities, and methods of fabrication

System and method for providing 3D wafer assembly with known-good-dies

Direct-bonded LED arrays and applications

Multi-chip modules formed using wafer-level processing of a reconstitute wafer

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Reversed build-up substrate for 2.5D

Batch process fabrication of package-on-package microelectronic assemblies

INVENSAS BONDING TECH INC

Direct-bonded optoelectronic interconnect for high-density integrated photonics

Cavity packages

Low temperature bonded structures

Bonded structures

Seal for microelectronic assembly

Bonded structures

Bonded structures

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Seal for microelectronic assembly

Seal for microelectronic assembly

ROBO IND INC

System for determining autonomous adjustments to an implement position and angle

Automated site based mission planning system

Vehicle automatic power and driving control

System for determining position of a vehicle

CHIRON CORP

Estrogen receptor modulators

Estrogen receptor modulators

Estrogen receptor modulators

Estrogen receptor modulators

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Bonded structures

Cavity packages

Low temperature bonded structures

FAIR ISAAC CORP

Mass compromise/point of compromise analytic detection and compromised card portfolio management system

Mass compromise/point of compromise analytic detection and compromised card portfolio management system

INVENSAS LLC

Multi-chip modules formed using wafer-level processing of a reconstituted wafer

(unassigned)

Ceramic coatings synthesized by chemical reactions energized by laser plasmas

XCELSIS CORP

Back biasing of FD-SOI circuit blocks

GAST MATTHEW STUART

Zero configuration networking on a subnetted network

UNIV ZHEJIANG TECHNOLOGY

Metal-based/diamond laser composite coating and preparation method thereof

WANG LIANG

Boride, carbide, nitride, oxynitride, and silicide infiltrated electrochemical ceramic films and coatings and the method of forming such

BORGWARD TRADEMARK HOLDINGS GMBH

Automobile

SHENZHEN CHENBEI TECH CO LTD

Kitchen scale

ADEIA SEMICONDUCTOR TECH LLC

Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements

KE COM BEIJING TECH CO LTD

Display screen or portion thereof with a graphical user interface

NINGBO TALLER INTELLIGENT TECH CO LTD

Air pump