Inventor · disambiguated record
Ernest J. Russell
Also filed as: RUSSELL ERNEST · RUSSELL ERNEST J
25 granted patents·906 citations·filing 1986–2003
97Inventor score
Top patents by PatentIndex Score
25 records- 0193US6548757B1Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 15, 2003·100 cites·24 claims
- 0291US5483024AHigh density semiconductor packageTEXAS INSTRUMENTS INC·Filed 1993·Granted Jan 9, 1996·120 cites·6 claims
- 0389US4975763AEdge-mounted, surface-mount package for semiconductor integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 1988·Granted Dec 4, 1990·86 cites·16 claims
- 0489US4759770AProcess for simultaneously dyeing and improving the flame-resistant properties of aramid fibersBURLINGTON INDUSTRIES INC·Filed 1986·Granted Jul 26, 1988·46 cites·18 claims
- 0586US5600178ASemiconductor package having interdigitated leadsTEXAS INSTRUMENTS INC·Filed 1995·Granted Feb 4, 1997·75 cites·6 claims
- 0682US4749378AProcess for improving the flame-resistant properties of aramid fibersBURLINGTON INDUSTRIES INC·Filed 1986·Granted Jun 7, 1988·28 cites·19 claims
- 0778US5432678AHigh power dissipation vertical mounted package for surface mount applicationTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 11, 1995·44 cites·13 claims
- 0876US5521426AReduced capacitance lead frame for lead on chip packageTEXAS INSTRUMENTS INC·Filed 1994·Granted May 28, 1996·53 cites·12 claims
- 0975US5637828AHigh density semiconductor packageTEXAS INSTRUMENTS INC·Filed 1995·Granted Jun 10, 1997·43 cites·14 claims
- 1072US5589420AMethod for a hybrid leadframe-over-chip semiconductor packageTEXAS INSTRUMENTS INC·Filed 1995·Granted Dec 31, 1996·37 cites·4 claims
- 1172US5545920ALeadframe-over-chip having off-chip conducting leads for increased bond pad connectivityTEXAS INSTRUMENTS INC·Filed 1994·Granted Aug 13, 1996·38 cites·9 claims
- 1271US6040983AVertical passive components for surface mount assemblyTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 21, 2000·40 cites·4 claims
- 1370US5260601AEdge-mounted, surface-mount package for semiconductor integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 1990·Granted Nov 9, 1993·37 cites·20 claims
- 1467US5413970AProcess for manufacturing a semiconductor package having two rows of interdigitated leadsTEXAS INSTRUMENTS INC·Filed 1993·Granted May 9, 1995·31 cites·4 claims
- 1565US4812140AContinuous aqueous dyeing process for high-tenacity industrial nylon fabricsBURLINGTON INDUSTRIES INC·Filed 1987·Granted Mar 14, 1989·15 cites·14 claims
- 1660US5534729AIntegrated circuit lead frame for coupling to non-neighboring bond padsTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 9, 1996·22 cites·17 claims
- 1758US6268643B1Lead frame device for delivering electrical power to a semiconductor dieTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 31, 2001·20 cites·13 claims
- 1856US6465278B2Method and apparatus for delivering electrical power to a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 15, 2002·6 cites·7 claims
- 1952US5396701AMethod for packaging an integrated circuitTEXAS INSTRUMENTS INC·Filed 1993·Granted Mar 14, 1995·17 cites·5 claims
- 2048US4832699AContinuous process for dyeing nylon fabricsBURLINGTON INDUSTRIES INC·Filed 1987·Granted May 23, 1989·7 cites·11 claims
- 2146US5231305ACeramic bonding bridgeTEXAS INSTRUMENTS INC·Filed 1990·Granted Jul 27, 1993·15 cites·18 claims
- 2245US5671125AVertical package mounted on both sides of a printed circuit boardTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 23, 1997·13 cites·11 claims
- 2342US6784367B2Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 31, 2004·1 cites·19 claims
- 2440US5275975AMethod of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded materialTEXAS INSTRUMENTS INC·Filed 1992·Granted Jan 4, 1994·9 cites·13 claims
- 2531US4878920AProcess for the continuous dyeing of industrial nylonBURLINGTON INDUSTRIES INC·Filed 1987·Granted Nov 7, 1989·3 cites·10 claims
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