Inventor
BAUDOUIN DANIEL A
US6 patents
Patents
6 patentsUS5483024AJan 9, 1996
High density semiconductor package
TEXAS INSTRUMENTS INC120 citations98
US4975763ADec 4, 1990
Edge-mounted, surface-mount package for semiconductor integrated circuit devices
TEXAS INSTRUMENTS INC86 citations95
US5637828AJun 10, 1997
High density semiconductor package
TEXAS INSTRUMENTS INC43 citations92
US5260601ANov 9, 1993
Edge-mounted, surface-mount package for semiconductor integrated circuit devices
TEXAS INSTRUMENTS INC37 citations92
US4994938AFeb 19, 1991
Mounting of high density components on substrate
TEXAS INSTRUMENTS INC33 citations91
US5275975AJan 4, 1994
Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material
TEXAS INSTRUMENTS INC9 citations73