P

Inventor

ESCORCIA ORLANDO

US13 patents
⚠️ This page may combine multiple inventors who share the name “ESCORCIA ORLANDO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AXCELIS TECH INC

8 patents
US6756085B2Jun 29, 2004

Ultraviolet curing processes for advanced low-k materials

AXCELIS TECH INC685 citations98
US6759098B2Jul 6, 2004

Plasma curing of MSQ-based porous low-k film materials

AXCELIS TECH INC580 citations96
US6951823B2Oct 4, 2005

Plasma ashing process

AXCELIS TECH INC35 citations92
US7629272B2Dec 8, 2009

Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics

AXCELIS TECH INC26 citations90
US7709814B2May 4, 2010

Apparatus and process for treating dielectric materials

AXCELIS TECH INC12 citations80
US7678682B2Mar 16, 2010

Ultraviolet assisted pore sealing of porous low k dielectric films

AXCELIS TECH INC7 citations73
US7011868B2Mar 14, 2006

Fluorine-free plasma curing process for porous low-k materials

AXCELIS TECH INC6 citations62
US7704872B2Apr 27, 2010

Ultraviolet assisted pore sealing of porous low k dielectric films

AXCELIS TECH INC1 citations52

DOW CORNING

1 patent
US6913796B2Jul 5, 2005

Plasma curing process for porous low-k materials

DOW CORNING527 citations95

AXCELIS TECHNOLOGIES

1 patent
US6630406B2Oct 7, 2003

Plasma ashing process

AXCELIS TECHNOLOGIES50 citations91

AXCELIS TECHNOLOGY INC

1 patent
US6834656B2Dec 28, 2004

Plasma process for removing polymer and residues from substrates

AXCELIS TECHNOLOGY INC30 citations86

INTEL CORP

1 patent
US7078161B2Jul 18, 2006

Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication

INTEL CORP3 citations62

LAM RES CORP

1 patent
US9128382B2Sep 8, 2015

Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process

LAM RES CORP0 citations37