Inventor

HUANG CHING-HAN

TW22 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHING-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG CHING-HAN

ADVANCED SEMICONDUCTOR ENG

Semiconductor package structure

Semiconductor package with inner and outer cavities

Semiconductor device package including a wall and a grounding ring exposed from the wall

Optical package structure and method of manufacturing the same

Semiconductor device package including cover including tilted inner sidewall

Electronic package structure

Semiconductor package and method for manufacturing the same

Semiconductor package structure and method of manufacturing the same

Semiconductor package structure

Semiconductor package and method for manufacturing the same

Semiconductor device package and a method of manufacturing the same

Semiconductor package including cap layer and dam structure and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and a method of manufacturing the same

Semiconductor package structures and methods of manufacturing the same

MEMS package structure and manufacturing method thereof

Optical device and method of manufacturing the same

Electronic device, lid structure and package structure

Semiconductor device package for reducing parasitic light and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Microelectromechanical systems package structure

LEE TIEN-HSI

Producing a transferred layer by implanting ions through a sacrificial layer and an etching stop layer