Inventor
CHANG CHIANG-CHENG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHIANG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
6 patentsUS10049955B2Aug 14, 2018
Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US9812340B2Nov 7, 2017
Method of fabricating semiconductor package having semiconductor element
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US9324585B2Apr 26, 2016
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US8766456B2Jul 1, 2014
Method of fabricating a semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US9041189B2May 26, 2015
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9899237B2Feb 20, 2018
Carrier, semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
CHANG CHIANG-CHENG
5 patentsUS9040361B2May 26, 2015
Chip scale package with electronic component received in encapsulant, and fabrication method thereof
CHANG CHIANG-CHENG13 citations82
US8680692B2Mar 25, 2014
Carrier, semiconductor package and fabrication method thereof
CHANG CHIANG-CHENG5 citations81
US8334174B2Dec 18, 2012
Chip scale package and fabrication method thereof
CHANG CHIANG-CHENG6 citations67
US8525348B2Sep 3, 2013
Chip scale package and fabrication method thereof
CHANG CHIANG-CHENG2 citations61
US8304665B2Nov 6, 2012
Package substrate having landless conductive traces
CHANG CHIANG-CHENG3 citations61