Inventor
PARK HEUNG KIL
KR109 patents
Patents
50 patentsUS10204739B1Feb 12, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH16 citations94
US10192686B1Jan 29, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH21 citations94
US10128050B1Nov 13, 2018
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH22 citations94
US10062511B1Aug 28, 2018
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH28 citations94
US9978523B1May 22, 2018
Multilayer capacitor and board having the multilayer capacitor mounted thereon
SAMSUNG ELECTRO MECH19 citations86
US10566137B2Feb 18, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US10347425B2Jul 9, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH12 citations84
US10325722B2Jun 18, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH11 citations84
US9928957B2Mar 27, 2018
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH9 citations84
US9799453B2Oct 24, 2017
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9775232B2Sep 26, 2017
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH14 citations84
US9706641B1Jul 11, 2017
Multilayer capacitor and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9491847B2Nov 8, 2016
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9288906B2Mar 15, 2016
Mounting circuit board of multilayer ceramic capacitor
SAMSUNG ELECTRO MECH13 citations84
US11139113B2Oct 5, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US11004608B2May 11, 2021
Composite electronic component
SAMSUNG ELECTRO MECH4 citations73
US10879000B2Dec 29, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH3 citations73
US10840022B2Nov 17, 2020
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US10777356B2Sep 15, 2020
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10658118B2May 19, 2020
Electronic component and board having the same
SAMSUNG ELECTRO MECH6 citations73
US10453616B2Oct 22, 2019
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations73
US10398030B2Aug 27, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH4 citations73
US10304618B2May 28, 2019
Electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations73
US10192682B1Jan 29, 2019
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations73
US10192685B2Jan 29, 2019
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH5 citations73
US10128048B2Nov 13, 2018
Multilayer capacitor and board having the same
SAMSUNG ELECTRO MECH6 citations73
US10074481B2Sep 11, 2018
Capacitor component and board having the same
SAMSUNG ELECTRO MECH3 citations73
US9984827B2May 29, 2018
Capacitor component
SAMSUNG ELECTRO MECH3 citations73
US9978525B2May 22, 2018
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH5 citations73
US9947459B2Apr 17, 2018
Surface mounted electronic component
SAMSUNG ELECTRO MECH3 citations73
US9881736B2Jan 30, 2018
Multilayer ceramic component
SAMSUNG ELECTRO MECH4 citations73
US9842699B2Dec 12, 2017
Multilayer ceramic capacitor having terminal electrodes and board having the same
SAMSUNG ELECTRO MECH2 citations73
US9824824B2Nov 21, 2017
Coil electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations73
US9648746B2May 9, 2017
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH3 citations73
US9627139B2Apr 18, 2017
Multilayered ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH3 citations73
US9607769B2Mar 28, 2017
Multilayer ceramic capacitor having terminal electrodes and board having the same
SAMSUNG ELECTRO MECH2 citations73
US9466427B2Oct 11, 2016
Multilayer ceramic component and board having the same
SAMSUNG ELECTRO MECH6 citations73
US9460854B2Oct 4, 2016
Multilayer ceramic electronic component with interposer substrate having double-layered resin/plating terminals
SAMSUNG ELECTRO MECH4 citations73
US9412520B2Aug 9, 2016
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH3 citations73
US9362054B2Jun 7, 2016
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH6 citations73
US9336945B2May 10, 2016
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH4 citations73
US9326381B2Apr 26, 2016
Multilayer ceramic capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH3 citations73
US9305704B2Apr 5, 2016
Multilayer ceramic capacitor and manufacturing method thereof
SAMSUNG ELECTRO MECH3 citations73
US9281126B2Mar 8, 2016
Multilayer ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH3 citations73
US9269491B2Feb 23, 2016
Multilayer ceramic capacitor and mounting circuit board therefor
SAMSUNG ELECTRO MECH4 citations73
US9245690B2Jan 26, 2016
Multilayer ceramic capacitor, board having the same mounted thereon, and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US9240281B2Jan 19, 2016
Multilayer ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH4 citations73
US9024202B2May 5, 2015
Electronic chip component and board having the same mounted thereon
SAMSUNG ELECTRO MECH4 citations73
US9024206B2May 5, 2015
Multilayered ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH4 citations73
US10229790B2Mar 12, 2019
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations72
Showing the top 50 of 109 patents by PatentIndex Score.