Inventor

CHANG CHIN-CHUAN

TW64 patents

⚠️ This page may combine multiple inventors who share the name “CHANG CHIN-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG CHIN-CHUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Devices employing thermal and mechanical enhanced layers and methods of forming same

Method of forming a semiconductor package

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor package

Devices employing thermal and mechanical enhanced layers and methods of forming same

3-D package having plurality of substrates

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor package and method of manufacturing the same

Structure and formation method of package structure with stacked semiconductor dies

Method and system for substrate thinning

Grinding element, grinding wheel and manufacturing method of semiconductor package using the same

Method of forming a semiconductor package

PoP device

Protective layer for contact pads in fan-out interconnect structure and method of forming same

Semiconductor package and method of manufacturing the same

Package structure

Method for forming package structure

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor package

Molding wafer chamber

Package structure and method for forming the same

3-D package having plurality of substrates

Semiconductor package and manufacturing method thereof

Package structure with stacked semiconductor dies

Apparatus for detecting end point

Apparatus for detecting end point

Semiconductor package and manufacturing method thereof

System for thinning substrate

Protective layer for contact pads in fan-out interconnect structure and method of forming same

Method for substrate thinning

Apparatus and method for detecting end point

Integrated circuit structure, and method for forming thereof

(unassigned)

Kite device

Automatic cleaner for a toilet seat

Tandem kite device

Kite

Kite assembly

Kite device

CHANG CHIN-CHUAN

Oxygen sensor bung of motor vehicle exhaust pipe

Exhaust tail pipe

Kite slider

TAIWAN SEMICONDUCTOR MFG

Package with a fan-out structure and method of forming the same

3D-packages and methods for forming the same

LIN JING-CHENG

Three dimensional (3D) fan-out packaging mechanisms

Molding wafer chamber

HUNG JUI-PIN

Packaging methods and structures using a die attach film

CHANG CHIN CHUAN

File holder

HU HSIEN-LIN

Protection structure forthermal dissipation and preventing thermal runaway diffusion in battery system

LIANG FEI IND CO LTD

Subsidiary loudspeaker for vehicles and bikes

LAM RES CORP

Cluster tools for processing substrates using at least a key file