Inventor
FU TSEI-CHUNG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “FU TSEI-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS9461018B1Oct 4, 2016
Fan-out PoP structure with inconsecutive polymer layer
TAIWAN SEMICONDUCTOR MFG CO LTD671 citations98
US9633924B1Apr 25, 2017
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10083913B2Sep 25, 2018
Fan-out POP structure with inconsecutive polymer layer
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US9847269B2Dec 19, 2017
Fan-out packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations82
US9941244B2Apr 10, 2018
Protective layer for contact pads in fan-out interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11515288B2Nov 29, 2022
Protective layer for contact pads in fan-out interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10748869B2Aug 18, 2020
Protective layer for contact pads in fan-out interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10636748B2Apr 28, 2020
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10224293B2Mar 5, 2019
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9741693B2Aug 22, 2017
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52