Inventor
FOH BARTHOLOMEW LIAO CHUNG
SG10 patents
⚠️ This page may combine multiple inventors who share the name “FOH BARTHOLOMEW LIAO CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC PTE LTD
4 patentsUS9865554B2Jan 9, 2018
Integrated circuit packaging system with under bump metallization and method of manufacture thereof
STATS CHIPPAC PTE LTD3 citations72
US9679769B1Jun 13, 2017
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof
STATS CHIPPAC PTE LTD1 citations51
US9659897B1May 23, 2017
Integrated circuit packaging system with interposer structure and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations50
US10109587B1Oct 23, 2018
Integrated circuit packaging system with substrate and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations49
CAMACHO ZIGMUND RAMIREZ
3 patentsUS9406531B1Aug 2, 2016
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ11 citations83
US9331003B1May 3, 2016
Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ15 citations83
US9355983B1May 31, 2016
Integrated circuit packaging system with interposer structure and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ5 citations82