Inventor

BAE HAN JUN

KR19 patents

⚠️ This page may combine multiple inventors who share the name “BAE HAN JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAE HAN JUN

SK HYNIX INC

Stack packages and methods of fabricating the same

Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same

Semiconductor packages including heat spreaders and methods of manufacturing the same

Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same

Stack packages and methods of fabricating the same

Stack packages and methods of manufacturing the same

Semiconductor package including stacked semiconductor chips

Stretchable semiconductor packages and semiconductor devices including the same

Stretchable semiconductor packages and semiconductor devices including the same

Stack packages and methods of manufacturing the same

Semiconductor package including capacitor

Semiconductor package

Flexible device including sliding interconnection structure

UNIV KOREA RES & BUS FOUND

Map compression method for indoor positioning

Low-power method and map data hierarchical segmentation load method for indoor positioning

BAE HAN JUN

Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode

Semiconductor package using through-electrodes having voids

HYNIX SEMICONDUCTOR INC

Semiconductor package having structure for warpage prevention

BAE SEOK HO

Device and method for mediating heavy equipment and system using the same