Inventor
OBRADOVIC BORNA J
US57 patents
⚠️ This page may combine multiple inventors who share the name “OBRADOVIC BORNA J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
44 patentsUS10026652B2Jul 17, 2018
Horizontal nanosheet FETs and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD21 citations94
US9812449B2Nov 7, 2017
Multi-VT gate stack for III-V nanosheet devices with reduced parasitic capacitance
SAMSUNG ELECTRONICS CO LTD30 citations94
US9741811B2Aug 22, 2017
Integrated circuit devices including source/drain extension regions and methods of forming the same
SAMSUNG ELECTRONICS CO LTD21 citations94
US9711414B2Jul 18, 2017
Strained stacked nanosheet FETS and/or quantum well stacked nanosheet
SAMSUNG ELECTRONICS CO LTD32 citations94
US9490323B2Nov 8, 2016
Nanosheet FETs with stacked nanosheets having smaller horizontal spacing than vertical spacing for large effective width
SAMSUNG ELECTRONICS CO LTD37 citations94
US10878317B2Dec 29, 2020
Method and system for performing analog complex vector-matrix multiplication
SAMSUNG ELECTRONICS CO LTD13 citations86
US11461620B2Oct 4, 2022
Multi-bit, SoC-compatible neuromorphic weight cell using ferroelectric FETs
SAMSUNG ELECTRONICS CO LTD5 citations84
US10164121B2Dec 25, 2018
Stacked independently contacted field effect transistor having electrically separated first and second gates
SAMSUNG ELECTRONICS CO LTD8 citations84
US9905672B2Feb 27, 2018
Method of forming internal dielectric spacers for horizontal nanosheet FET architectures
SAMSUNG ELECTRONICS CO LTD14 citations84
US9484423B2Nov 1, 2016
Crystalline multiple-nanosheet III-V channel FETs
SAMSUNG ELECTRONICS CO LTD16 citations84
US10566330B2Feb 18, 2020
Dielectric separation of partial GAA FETs
SAMSUNG ELECTRONICS CO LTD10 citations82
US9831323B2Nov 28, 2017
Structure and method to achieve compressively strained Si NS
SAMSUNG ELECTRONICS CO LTD8 citations82
US11983622B2May 14, 2024
High-density neuromorphic computing element
SAMSUNG ELECTRONICS CO LTD1 citations73
US10909449B2Feb 2, 2021
Monolithic multi-bit weight cell for neuromorphic computing
SAMSUNG ELECTRONICS CO LTD3 citations73
US10679688B2Jun 9, 2020
Ferroelectric-based memory cell usable in on-logic chip memory
SAMSUNG ELECTRONICS CO LTD3 citations73
US10586738B2Mar 10, 2020
Method of providing source and drain doping for CMOS architecture including FinFET and semiconductor devices so formed
SAMSUNG ELECTRONICS CO LTD3 citations73
US10585630B2Mar 10, 2020
Selectorless 3D stackable memory
SAMSUNG ELECTRONICS CO LTD3 citations73
US10446400B2Oct 15, 2019
Method of forming multi-threshold voltage devices and devices so formed
SAMSUNG ELECTRONICS CO LTD2 citations73
US10312152B2Jun 4, 2019
Field effect transistor with stacked nanowire-like channels and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10199474B2Feb 5, 2019
Field effect transistor with decoupled channel and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US10170549B2Jan 1, 2019
Strained stacked nanosheet FETs and/or quantum well stacked nanosheet
SAMSUNG ELECTRONICS CO LTD4 citations73
US10026751B2Jul 17, 2018
Semiconductor device including a repeater/buffer at higher metal routing layers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US9614002B1Apr 4, 2017
0T bi-directional memory cell
SAMSUNG ELECTRONICS CO LTD2 citations72
US12333422B2Jun 17, 2025
High-density neuromorphic computing element
SAMSUNG ELECTRONICS CO LTD0 citations63
US11586901B2Feb 21, 2023
High-density neuromorphic computing element
SAMSUNG ELECTRONICS CO LTD0 citations63
US10964698B2Mar 30, 2021
Field effect transistor with decoupled channel and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations63
US10381271B2Aug 13, 2019
Field effect transistor with stacked nanowire-like channels and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations63
US12260324B2Mar 25, 2025
Monolithic multi-bit weight cell for neuromorphic computing
SAMSUNG ELECTRONICS CO LTD0 citations62
US11816563B2Nov 14, 2023
Method of enabling sparse neural networks on memresistive accelerators
SAMSUNG ELECTRONICS CO LTD0 citations62
US11727258B2Aug 15, 2023
Multi-bit, SoC-compatible neuromorphic weight cell using ferroelectric FETs
SAMSUNG ELECTRONICS CO LTD0 citations62
US11574193B2Feb 7, 2023
Method and system for training of neural networks using continuously differentiable models
SAMSUNG ELECTRONICS CO LTD1 citations62
US11476121B2Oct 18, 2022
Method of forming multi-threshold voltage devices and devices so formed
SAMSUNG ELECTRONICS CO LTD1 citations62
US11404405B2Aug 2, 2022
Semiconductor device including a repeater/buffer at upper metal routing layers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10930768B2Feb 23, 2021
Low current leakage finFET and methods of making the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10739186B2Aug 11, 2020
Bi-directional weight cell
SAMSUNG ELECTRONICS CO LTD1 citations62
US10614868B2Apr 7, 2020
Memory device with strong polarization coupling
SAMSUNG ELECTRONICS CO LTD1 citations62
US10497719B2Dec 3, 2019
Method for selectively increasing silicon fin area for vertical field effect transistors
SAMSUNG ELECTRONICS CO LTD1 citations62
US10461751B2Oct 29, 2019
FE-FET-based XNOR cell usable in neuromorphic computing
SAMSUNG ELECTRONICS CO LTD1 citations62
US10957786B2Mar 23, 2021
FinFET with reduced extension resistance and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11290110B2Mar 29, 2022
Method and system for providing a variation resistant magnetic junction-based XNOR cell usable in neuromorphic computing
SAMSUNG ELECTRONICS CO LTD0 citations52
US10860923B2Dec 8, 2020
High-density neuromorphic computing element
SAMSUNG ELECTRONICS CO LTD0 citations52
US10854591B2Dec 1, 2020
Semiconductor device including a repeater/buffer at upper metal routing layers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10700068B2Jun 30, 2020
Field effect transistor with decoupled channel and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10644031B2May 5, 2020
Method for selectively increasing silicon fin area for vertical field effect transistors
SAMSUNG ELECTRONICS CO LTD0 citations52
OBRADOVIC BORNA J
4 patentsUS9570609B2Feb 14, 2017
Crystalline multiple-nanosheet strained channel FETs and methods of fabricating the same
OBRADOVIC BORNA J56 citations97
US9461114B2Oct 4, 2016
Semiconductor devices with structures for suppression of parasitic bipolar effect in stacked nanosheet FETs and methods of fabricating the same
OBRADOVIC BORNA J43 citations93
US9793403B2Oct 17, 2017
Multi-layer fin field effect transistor devices and methods of forming the same
OBRADOVIC BORNA J9 citations83
US9178045B2Nov 3, 2015
Integrated circuit devices including FinFETS and methods of forming the same
OBRADOVIC BORNA J9 citations83
ANTONACCI ANTHONY G
1 patentRODDER MARK S
1 patentShowing the top 50 of 57 patents by PatentIndex Score.