Inventor · disambiguated record
Tetsuya Akaiwa
Also filed as: AKAIWA TETSUYA
2 granted patents·2 pending applications·0 citations·filing 2018–2020
23Inventor score
Files withNIHON SUPERIOR CO LTD4
Top patents by PatentIndex Score
4 records- 0169US12172242B2Lead-free solder alloyNIHON SUPERIOR CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·12 claims
- 0253US11980974B2Solder joint part and method for manufacturing the sameNIHON SUPERIOR CO LTD·Filed 2019·Granted May 14, 2024·0 cites·8 claims
- 0340US2022281035A1Solder-metal mesh composite material and method for producing sameNIHON SUPERIOR CO LTD·Filed 2020·Application pending·0 cites
- 0438US2020140975A1Soldered JointNIHON SUPERIOR CO LTD·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →