Inventor · disambiguated record
Gary H. Irish
Also filed as: IRISH GARY H
6 granted patents·333 citations·filing 1991–2000
87Inventor score
Technology areasH10W
Files withIBM6
Top patents by PatentIndex Score
6 records- 0190US5086018AMethod of making a planarized thin film covered wire bonded semiconductor packageIBM·Filed 1991·Granted Feb 4, 1992·155 cites·11 claims
- 0277US5151559APlanarized thin film surface covered wire bonded semiconductor packageIBM·Filed 1991·Granted Sep 29, 1992·61 cites·9 claims
- 0375US5585600AEncapsulated semiconductor chip module and method of forming the sameIBM·Filed 1993·Granted Dec 17, 1996·57 cites·8 claims
- 0470US5608260ALeadframe having contact pads defined by a polymer insulating filmIBM·Filed 1994·Granted Mar 4, 1997·38 cites·14 claims
- 0564US6603195B1Planarized plastic package modules for integrated circuitsIBM·Filed 2000·Granted Aug 5, 2003·15 cites·16 claims
- 0638US5776801ALeadframe having contact pads defined by a polymer insulating filmIBM·Filed 1996·Granted Jul 7, 1998·7 cites·14 claims
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