Inventor · disambiguated record
Masatsugu Ogata
Also filed as: OGATA MASATSUGU
36 granted patents·1,075 citations·filing 1974–2004
98Inventor score
Top patents by PatentIndex Score
36 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0293US4387311AUninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler compositionHITACHI LTD·Filed 1981·Granted Jun 7, 1983·82 cites·14 claims
- 0393US4352897AResin molded statorsHITACHI LTD·Filed 1979·Granted Oct 5, 1982·81 cites·12 claims
- 0489US6114005ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1997·Granted Sep 5, 2000·98 cites·19 claims
- 0588US5677045ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1995·Granted Oct 14, 1997·86 cites·8 claims
- 0686US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 0784US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 0880US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 0980US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 1079US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1179US3947395AEpoxy surface coating compositionsHITACHI LTD·Filed 1974·Granted Mar 30, 1976·28 cites·12 claims
- 1278US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 1378US5602420AStacked high mounting density semiconductor devicesHITACHI LTD·Filed 1995·Granted Feb 11, 1997·65 cites·30 claims
- 1478US4366516APrecision machinery componentHITACHI LTD·Filed 1980·Granted Dec 28, 1982·30 cites·23 claims
- 1575US4393177AThermosetting resin composition, process for preparation thereof and cured product thereofHITACHI LTD·Filed 1981·Granted Jul 12, 1983·21 cites·24 claims
- 1674US6632881B1Encapsulant of epoxy resin and liquid aromatic amine curing agentHITACHI CHEMICAL CO LTD·Filed 2000·Granted Oct 14, 2003·21 cites·15 claims
- 1774US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 1869US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 1969US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 2067US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 2167US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 2263US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 2363US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 2463US4965657AResin encapsulated semiconductor deviceHITACHI LTD·Filed 1988·Granted Oct 23, 1990·13 cites·12 claims
- 2561US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 2658US4129678ASelf-bondable insulated wires comprising three coatings including a phenoxy resin outer layerHITACHI LTD·Filed 1977·Granted Dec 12, 1978·14 cites·10 claims
- 2753US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 2851US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 2951US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 3050US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 3150US5181097APlastic molded type electronic deviceHITACHI LTD·Filed 1990·Granted Jan 19, 1993·19 cites·9 claims
- 3244US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 3341US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 3437US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 3537US5225499AResin composition for encapsulating of semiconductor and semiconductor apparatus using of the sameHITACHI LTD·Filed 1991·Granted Jul 6, 1993·8 cites·7 claims
- 3632US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
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