Inventor
HORKANS WILMA JEAN
US11 patents
Patents
11 patentsUS6224690B1May 1, 2001
Flip-Chip interconnections using lead-free solders
IBM191 citations98
US5937320AAug 10, 1999
Barrier layers for electroplated SnPb eutectic solder joints
IBM297 citations98
US6709562B1Mar 23, 2004
Method of making electroplated interconnection structures on integrated circuit chips
IBM90 citations97
US6113769ASep 5, 2000
Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
IBM96 citations97
US6974531B2Dec 13, 2005
Method for electroplating on resistive substrates
IBM20 citations92
US6429523B1Aug 6, 2002
Method for forming interconnects on semiconductor substrates and structures formed
IBM32 citations92
US6406608B1Jun 18, 2002
Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metal
IBM19 citations92
US6946716B2Sep 20, 2005
Electroplated interconnection structures on integrated circuit chips
IBM16 citations82
US6570255B2May 27, 2003
Method for forming interconnects on semiconductor substrates and structures formed
IBM7 citations73
US6592747B2Jul 15, 2003
Method of controlling additives in copper plating baths
IBM7 citations72
US7227265B2Jun 5, 2007
Electroplated copper interconnection structure, process for making and electroplating bath
IBM1 citations51