Inventor · disambiguated record
Sadiq Bengali
Also filed as: BENGALI SADIQ · BENGALI SADIQ S
20 granted patents·4 pending applications·137 citations·filing 2001–2016
93Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO17BENGALI SADIQ2ABBOTT JR JAMES E1HEWLETT PACKARD CO1HEWLETT PACKARD DEVELOPEMENT C1
Top patents by PatentIndex Score
24 records- 0191US9403372B2Fluid ejection device with ACEO pumpTAFF BRIAN M·Filed 2012·Granted Aug 2, 2016·8 cites·17 claims
- 0286US6917459B2MEMS device and method of forming MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 12, 2005·35 cites·56 claims
- 0383US6475402B2Ink feed channels and heater supports for thermal ink-jet printheadHEWLETT PACKARD CO·Filed 2001·Granted Nov 5, 2002·28 cites·9 claims
- 0478US8690295B2Fluid nozzle arrayBENGALI SADIQ·Filed 2010·Granted Apr 8, 2014·3 cites·15 claims
- 0578US6764605B2Particle tolerant architecture for feed holes and method of manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 20, 2004·19 cites·4 claims
- 0675US7285226B2Method for fabricating a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 23, 2007·15 cites·36 claims
- 0772US6582063B1Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jun 24, 2003·15 cites·23 claims
- 0870US7781843B1Integrating high-voltage CMOS devices with low-voltage CMOSHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 24, 2010·6 cites·15 claims
- 0968US7837303B2Inkjet printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Nov 23, 2010·2 cites·3 claims
- 1066US7612859B2Ultra-violet radiation absorbing gridHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 3, 2009·2 cites·31 claims
- 1164US9033470B2Fluid ejection assembly and related methodsBENGALI SADIQ·Filed 2011·Granted May 19, 2015·1 cites·16 claims
- 1259US7427125B2Inkjet printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Sep 23, 2008·1 cites·12 claims
- 1351US10725019B2Microfluidic chip for coagulation sensingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jul 28, 2020·0 cites·17 claims
- 1450US10850275B2Gold sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Dec 1, 2020·0 cites·9 claims
- 1549US7569404B2Ink-jet printhead fabricationHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Aug 4, 2009·0 cites·8 claims
- 1647US10876986B2Insulated sensorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Dec 29, 2020·0 cites·20 claims
- 1747US7037736B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 2, 2006·2 cites·6 claims
- 1846US10639630B2Microfluidic temperature controlHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted May 5, 2020·0 cites·14 claims
- 1944US8684501B2Fluid ejection deviceABBOTT JR JAMES E·Filed 2010·Granted Apr 1, 2014·0 cites·15 claims
- 2043US11008214B2Substrate assembly and related methodsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted May 18, 2021·0 cites·19 claims
- 2138US2010231655A1Inkjet-printing device printhead die having edge protection layer for heating resistorHEWLETT PACKARD DEVELOPEMENT C·Filed 2007·Application pending·0 cites
- 2236US2003202264A1Micro-mirror deviceFiled 2002·Application pending·0 cites
- 2336US2018224384A1Electrode systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
- 2435US2018236765A1Fluid deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
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