Inventor · disambiguated record
Stephen Babinetz
Also filed as: BABINETZ STEPHEN · BABINETZ STEPHEN E
6 granted patents·3 pending applications·181 citations·filing 2002–2024
83Inventor score
Top patents by PatentIndex Score
9 records- 0194US7229906B2Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machineKULICKE & SOFFA IND INC·Filed 2002·Granted Jun 12, 2007·136 cites·20 claims
- 0286US7188759B2Methods for forming conductive bumps and wire loopsKULICKE & SOFFA IND INC·Filed 2005·Granted Mar 13, 2007·24 cites·20 claims
- 0382US7464854B2Method and apparatus for forming a low profile wire loopKULICKE & SOFFA IND INC·Filed 2006·Granted Dec 16, 2008·13 cites·14 claims
- 0477US7651022B2Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machineKULICKE & SOFFA IND INC·Filed 2007·Granted Jan 26, 2010·7 cites·12 claims
- 0566US10665564B2On-bonder automatic overhang die optimization tool for wire bonding and related methodsKULICKE & SOFFA IND INC·Filed 2018·Granted May 26, 2020·0 cites·20 claims
- 0663US10121759B2On-bonder automatic overhang die optimization tool for wire bonding and related methodsKULICKE & SOFFA IND INC·Filed 2016·Granted Nov 6, 2018·1 cites·11 claims
- 0759US2025201765A1Methods of operating wire bonding systems, including methods of detecting and/or preventing wire fly-out on such systemsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 0841US2010186991A1conductive bumps, wire loops including the improved conductive bumps, and methods of forming the sameKULICKE & SOFFA IND INC·Filed 2006·Application pending·0 cites
- 0934US2006186179A1Apparatus and method for bonding wiresLEVINE LEE R·Filed 2005·Application pending·0 cites
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