Inventor · disambiguated record
Hiroyuki Ohtsubo
Also filed as: OHTSUBO HIROYUKI
4 granted patents·148 citations·filing 2002–2007
76Inventor score
Top patents by PatentIndex Score
4 records- 0194US7229906B2Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machineKULICKE & SOFFA IND INC·Filed 2002·Granted Jun 12, 2007·136 cites·20 claims
- 0277US7651022B2Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machineKULICKE & SOFFA IND INC·Filed 2007·Granted Jan 26, 2010·7 cites·12 claims
- 0360US7802556B2Homogeneous charge compressed ignition engine operating methodYANMAR CO LTD·Filed 2007·Granted Sep 28, 2010·4 cites·28 claims
- 0443US7900600B2Homogeneous charge compressed ignition engine operating methodYANMAR CO LTD·Filed 2007·Granted Mar 8, 2011·1 cites·6 claims
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