Inventor · disambiguated record
Tomomichi Takatsu
Also filed as: TAKATSU TOMOMICHI
9 granted patents·3 pending applications·12 citations·filing 2006–2012
80Inventor score
Top patents by PatentIndex Score
12 records- 0170US8389629B2Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic partSAITO TAKESHI·Filed 2007·Granted Mar 5, 2013·5 cites·15 claims
- 0262US9422462B2Adhesive sheetSAITO TAKESHI·Filed 2012·Granted Aug 23, 2016·1 cites·4 claims
- 0361US8652942B2Method for manufacturing electronic partsSAITO TAKESHI·Filed 2011·Granted Feb 18, 2014·1 cites·5 claims
- 0461US8114759B2Dicing method using a die attach film on an adhesive sheetSAITO TAKESHI·Filed 2009·Granted Feb 14, 2012·2 cites·2 claims
- 0560US8236416B2Adhesive sheet and process for producing electric components using the sheetKAWATA SATORU·Filed 2006·Granted Aug 7, 2012·2 cites·1 claims
- 0651US8764933B2Adhesive and adhesive sheetTAKATSU TOMOMICHI·Filed 2010·Granted Jul 1, 2014·1 cites·8 claims
- 0748US8399338B2Electronic component manufacturing methodSAITO TAKESHI·Filed 2009·Granted Mar 19, 2013·0 cites·12 claims
- 0843US2010240196A1Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for an electronic partSAITO TAKESHI·Filed 2007·Application pending·0 cites
- 0938US8975347B2Method for manufacturing electronic componentSAITO TAKESHI·Filed 2011·Granted Mar 10, 2015·0 cites·4 claims
- 1035US2012231266A1Adhesive sheet and electronic componentSAITOH TAKESHI·Filed 2010·Application pending·0 cites
- 1129US9267059B2Adhesive sheet and method of backgrinding semiconductor waferKUME MASASHI·Filed 2010·Granted Feb 23, 2016·0 cites·4 claims
- 1228US2012258572A1Adhesive sheet and production method for electronic componentTAKATSU TOMOMICHI·Filed 2010·Application pending·0 cites
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