Inventor · disambiguated record
Yasunari Hino
Also filed as: HINO YASUNARI
16 granted patents·4 pending applications·53 citations·filing 2003–2024
90Inventor score
Top patents by PatentIndex Score
20 records- 0184US7960880B2Automotive electric motor-generator with radial plates and circuit boards disposed in a fan shape in a common plane around shaft of rotorMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jun 14, 2011·11 cites·12 claims
- 0281US8319381B2Automotive electric motor-generator with radial plates and circuit boards disposed in a fan shape in a common plane around shaft of rotorHINO YASUNARI·Filed 2011·Granted Nov 27, 2012·5 cites·9 claims
- 0379US9362242B2Bonding structure including metal nano particleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 7, 2016·7 cites·8 claims
- 0476US10546800B2Semiconductor module, method for manufacturing the same and electric power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 28, 2020·2 cites·20 claims
- 0571US7423342B2Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machineMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Sep 9, 2008·5 cites·9 claims
- 0670US7151311B2Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layerMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 19, 2006·19 cites·4 claims
- 0768US10615131B2Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 7, 2020·1 cites·24 claims
- 0867US12476190B2Semiconductor device, power converter, method for manufacturing semiconductor device, and method for manufacturing power converterMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 18, 2025·0 cites·5 claims
- 0962US8610263B2Semiconductor device moduleHINO YASUNARI·Filed 2010·Granted Dec 17, 2013·2 cites·12 claims
- 1061US9324684B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 26, 2016·1 cites·20 claims
- 1158US2024234348A9Semiconductor device, power conversion device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1257US2024030087A1Semiconductor device, method of manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1356US2024395678A1Semiconductor device, method of manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1455US11183457B2Semiconductor device, power converter, method for manufacturing semiconductor device, and method for manufacturing power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 23, 2021·0 cites·4 claims
- 1555US2025054830A1Semiconductor module, power semiconductor device, method for manufacturing semiconductor module, method for manufacturing power semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1654US10475721B2Power semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 12, 2019·0 cites·1 claims
- 1753US12492488B2Silicon carbide epitaxial growth device and method of manufacturing silicon carbide epitaxial waferMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 9, 2025·0 cites·7 claims
- 1848US10283430B2Power semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 7, 2019·0 cites·4 claims
- 1943US9698078B2Semiconductor module and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 4, 2017·0 cites·12 claims
- 2042US9627350B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 18, 2017·0 cites·7 claims
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