Inventor
LIN CHUNG-HSIN
TW4 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUNG-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NANYA TECHNOLOGY CORP
3 patentsUS9659886B2May 23, 2017
Method of fabricating semiconductor device having voids between top metal layers of metal interconnects
NANYA TECHNOLOGY CORP7 citations80
US7157381B2Jan 2, 2007
Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits
NANYA TECHNOLOGY CORP2 citations58
US9418949B2Aug 16, 2016
Semiconductor device having voids between top metal layers of metal interconnects
NANYA TECHNOLOGY CORP0 citations48