Inventor
KUK KEON
KR55 patents
⚠️ This page may combine multiple inventors who share the name “KUK KEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
48 patentsUS10274247B2Apr 30, 2019
Refrigerator and vacuum insulation panel thereof
SAMSUNG ELECTRONICS CO LTD57 citations97
US6561625B2May 13, 2003
Bubble-jet type ink-jet printhead and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD76 citations97
US11047616B2Jun 29, 2021
Refrigerator and vacuum insulation module thereof
SAMSUNG ELECTRONICS CO LTD27 citations93
US7775179B2Aug 17, 2010
Apparatus and method for fabricating a color filter
SAMSUNG ELECTRONICS CO LTD20 citations92
US7275308B2Oct 2, 2007
Method for manufacturing a monolithic ink-jet printhead
SAMSUNG ELECTRONICS CO LTD19 citations92
US7018017B2Mar 28, 2006
Monolithic ink-jet printhead having a heater disposed between dual ink chambers and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD24 citations92
US6868605B2Mar 22, 2005
Method of manufacturing a bubble-jet type ink-jet printhead
SAMSUNG ELECTRONICS CO LTD20 citations92
US6806108B2Oct 19, 2004
Method of manufacturing monolithic ink-jet printhead
SAMSUNG ELECTRONICS CO LTD33 citations92
US6652077B2Nov 25, 2003
High-density ink-jet printhead having a multi-arrayed structure
SAMSUNG ELECTRONICS CO LTD20 citations92
US7207662B2Apr 24, 2007
Ink-jet printhead
SAMSUNG ELECTRONICS CO LTD14 citations84
US7163278B2Jan 16, 2007
Ink-jet printhead with improved ink ejection linearity and operating frequency
SAMSUNG ELECTRONICS CO LTD11 citations84
US10201072B2Feb 5, 2019
EMI shielding structure and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD9 citations83
US9434838B2Sep 6, 2016
Multi-color ink for 3D printing, 3D printer, and method of controlling the 3D printer
SAMSUNG ELECTRONICS CO LTD16 citations83
US10281176B2May 7, 2019
Magnetic cooling apparatus and magnetic refrigerating system having the same
SAMSUNG ELECTRONICS CO LTD7 citations82
US9696083B2Jul 4, 2017
Refrigerator
SAMSUNG ELECTRONICS CO LTD11 citations74
US6692112B2Feb 17, 2004
Monolithic ink-jet printhead
SAMSUNG ELECTRONICS CO LTD10 citations74
US10531599B2Jan 7, 2020
Electromagnetic interference shielding structure
SAMSUNG ELECTRONICS CO LTD2 citations73
US10030895B2Jul 24, 2018
Magnetic regenerator unit and magnetic cooling system with the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US10852054B2Dec 1, 2020
Refrigerator
SAMSUNG ELECTRONICS CO LTD6 citations72
US10624248B2Apr 14, 2020
EMI shielding structure and manufacturing method therefor
SAMSUNG ELECTRONICS CO LTD2 citations72
US9964344B2May 8, 2018
Magnetic cooling apparatus
SAMSUNG ELECTRONICS CO LTD2 citations72
US10566293B2Feb 18, 2020
Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
SAMSUNG ELECTRONICS CO LTD4 citations71
US10477687B2Nov 12, 2019
Manufacturing method for EMI shielding structure
SAMSUNG ELECTRONICS CO LTD2 citations71
US10306816B2May 28, 2019
EMI shielding structure
SAMSUNG ELECTRONICS CO LTD2 citations71
US7367656B2May 6, 2008
Ink-jet printhead and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7201461B2Apr 10, 2007
Apparatus for controlling a temperature of an ink-jet printhead
SAMSUNG ELECTRONICS CO LTD6 citations63
US10594020B2Mar 17, 2020
Electronic device having antenna element and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US8879935B2Nov 4, 2014
Apparatus and method to control temperature of heating roller used in fusing device of image forming apparatus
SAMSUNG ELECTRONICS CO LTD2 citations62
US7695105B2Apr 13, 2010
Nozzle plate, inkjet printhead with the same and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US7487590B2Feb 10, 2009
Method for manufacturing monolithic ink-jet printhead having heater disposed between dual ink chambers
SAMSUNG ELECTRONICS CO LTD5 citations62
US7465404B2Dec 16, 2008
Ink-jet printhead and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US7404624B2Jul 29, 2008
Ink-jet printhead and ink expelling method using a laser
SAMSUNG ELECTRONICS CO LTD4 citations62
US7210766B2May 1, 2007
Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heater
SAMSUNG ELECTRONICS CO LTD4 citations62
US7101024B2Sep 5, 2006
Ink-jet printhead
SAMSUNG ELECTRONICS CO LTD3 citations62
US7073891B2Jul 11, 2006
Monolithic ink-jet printhead having a metal nozzle plate and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD2 citations62
US6979076B2Dec 27, 2005
Ink-jet printhead
SAMSUNG ELECTRONICS CO LTD3 citations62
US11445645B2Sep 13, 2022
Hollow shielding structure for different types of circuit elements and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations61
US10477737B2Nov 12, 2019
Manufacturing method of a hollow shielding structure for circuit elements
SAMSUNG ELECTRONICS CO LTD1 citations61
US6598961B2Jul 29, 2003
Bubble-jet type ink-jet printhead
SAMSUNG ELECTRONICS CO LTD5 citations61
US9217967B2Dec 22, 2015
Fusing device and method using induction heating and image forming apparaus including the fusing device
SAMSUNG ELECTRONICS CO LTD1 citations52
US8811877B2Aug 19, 2014
Induction heating type fusing device and image forming apparatus employing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7549737B2Jun 23, 2009
Piezoelectric inkjet printhead having a unidirectional shutter
SAMSUNG ELECTRONICS CO LTD0 citations52
US7484833B2Feb 3, 2009
Droplet ejector and ink-jet printhead using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10937738B2Mar 2, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9599375B2Mar 21, 2017
Magnetic cooling apparatus
SAMSUNG ELECTRONICS CO LTD1 citations51
US8011750B2Sep 6, 2011
Method and apparatus for detecting missing nozzle in thermal inkjet printhead
SAMSUNG ELECTRONICS CO LTD0 citations51
US7240994B2Jul 10, 2007
Method of driving an ink-jet printhead
SAMSUNG ELECTRONICS CO LTD1 citations51
US10913201B2Feb 9, 2021
Object forming apparatus and controlling method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
JEONG HEE-MOON
1 patentKIM DAE-HWAN
1 patentShowing the top 50 of 55 patents by PatentIndex Score.