Inventor · disambiguated record
Yunxiang Di
Also filed as: DI YUNXIANG
2 granted patents·2 citations·filing 2019–2023
39Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0168US11695387B2Air gap type semiconductor device package structure and fabrication method thereofNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2019·Granted Jul 4, 2023·2 cites·17 claims
- 0262US11979136B2Air gap type semiconductor device package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Granted May 7, 2024·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →