Inventor

LIN WEN-YI

TW63 patents

⚠️ This page may combine multiple inventors who share the name “LIN WEN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN WEN-YI

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated fan-out package on package structure and methods of forming same

Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate

Package on packaging structure and methods of making same

Method of forming encapsulated semiconductor device package

Systems for semiconductor package mounting with improved co-planarity

Structure and formation method of chip package with protective lid

Semiconductor package and method for forming the same

Method for forming package structure

Wafer warpage inspection system and method using the same

Semiconductor package assembly, semiconductor package and forming method thereof

3D packages and methods for forming the same

Dummy through vias for integrated circuit packages and methods of forming the same

Semiconductor package

Method for forming semiconductor package

Package structure with protective lid

Heterostructure channel layer for semiconductor devices

MICROCOATING TECHNOLOGIES INC

Formation of thin film capacitors

Formation of thin film resistors

Epitaxial thin films

Resistors for electronic packaging

DARWIN PRECISIONS CORP

Display

Display

Metal backplate and foldable display using the same

Metal mask

LIN WEN-YI

Showerhead

Board-level package with tuned mass damping structure

Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas

Lid design for reliability enhancement in flip chip package

MORTON INT INC

Precursor solution compositions for electronic devices using CCVD

Formation of thin film resistors

Deposition of resistor materials directly on insulating substrates

LIN WEN YI

Ring structure for chip packaging

Supporting device for toilet tissue

Check valve

MICROCOATING TECHNOLOGIES

Formation of thin film capacitors

Nanolaminated thin film circuitry materials

(unassigned)

Shower head assembly

Nanolaminated thin film circuitry materials

TAIWAN SEMICONDUCTOR MFG

Semiconductor device package and method

Semiconductor device package and method

YEW MING-CHIH

Packaging structures and methods for semiconductor devices

Electrical connection for chip scale packaging

LIN PO-YAO

Thermally enhanced heat spreader for flip chip packaging

Compressive ring structure for flip chip packaging

SHIPLEY CO LLC

Formation of thin film capacitors

GEORGIA TECH RES INST

Ceramic compositions for microwave wireless communication

MORTON INTERNAT

Resistors for electronic packaging

FAR EASTERN TEXTILE LTD

Optical compensator for a liquid crystal display

MEDIATEK INC

Flip-flop circuit and scan chain using the same

LAI PO-LIN

Active device array substrate and method for fabricating the same