Inventor · disambiguated record
W. Jeff Reeder
Also filed as: REEDER W JEFF
6 granted patents·73 citations·filing 2000–2005
84Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC6
Top patents by PatentIndex Score
6 records- 0185US6544864B2Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materialsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·30 cites·24 claims
- 0282US6426552B1Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materialsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 30, 2002·24 cites·28 claims
- 0369US6717259B2Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materialsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·10 cites·31 claims
- 0461US7071078B2Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materialsMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 4, 2006·6 cites·30 claims
- 0553US6864153B2Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one anotherMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 8, 2005·3 cites·28 claims
- 0649US7268059B2Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 11, 2007·0 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →