Inventor

HUANG WEN-PING

TW9 patents

⚠️ This page may combine multiple inventors who share the name “HUANG WEN-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG WEN-PING

3 patents

US7446401B2Nov 4, 2008

Structure of power semiconductor with twin metal and ceramic plates

HUANG WEN-PING1 citations46

US8404565B2Mar 26, 2013

Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate

HUANG WEN-PING0 citations36

US8791551B2Jul 29, 2014

Well-through type diode element/component and manufacturing method for them

HUANG WEN-PING0 citations25

(unassigned)

2 patents

US6334971B1Jan 1, 2002

Manufacturing method for diode group processed by injection molding on the surface

6 citations58

US6085396AJul 11, 2000

Manufacturing method for rectifying diodes

5 citations58

CHI MEI CORP

1 patent

US5668207ASep 16, 1997

Styrenic resin composition

CHI MEI CORP20 citations89

LU YING-CHIH

1 patent

US8560867B2Oct 15, 2013

Server system and method for processing power off

LU YING-CHIH0 citations49

FORMOSA MICROSEMI CO LTD

1 patent

US9064856B1Jun 23, 2015

Flip-chip LED component built therein with a zener chip

FORMOSA MICROSEMI CO LTD3 citations48

TSAI SHEAU-FENG

1 patent

US8742533B2Jun 3, 2014

Constant current semiconductor device having a schottky barrier

TSAI SHEAU-FENG0 citations22