Inventor
LU JING RUEI
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LU JING RUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS9583474B2Feb 28, 2017
Package on packaging structure and methods of making same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11417643B2Aug 16, 2022
Package-on-package with redistribution structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9666556B2May 30, 2017
Flip chip packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627355B2Apr 18, 2017
Package-on-package structure having polymer-based material for warpage control
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9793242B2Oct 17, 2017
Packages with die stack including exposed molding underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11725120B2Aug 15, 2023
Carrier tape system and methods of making and using the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations69
US11133285B2Sep 28, 2021
Package-on-package structure having polymer-based material for warpage control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10515941B2Dec 24, 2019
Methods of forming package-on-package structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269763B2Apr 23, 2019
Package-on-package structure having polymer-based material for warpage control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9859265B2Jan 2, 2018
Package structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52