Inventor
PAI TSUNG-MING
TW7 patents
⚠️ This page may combine multiple inventors who share the name “PAI TSUNG-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
5 patentsUS6503776B2Jan 7, 2003
Method for fabricating stacked chip package
ADVANCED SEMICONDUCTOR ENG75 citations95
US7052935B2May 30, 2006
Flip-chip package and fabricating process thereof
ADVANCED SEMICONDUCTOR ENG80 citations92
US6387728B1May 14, 2002
Method for fabricating a stacked chip package
ADVANCED SEMICONDUCTOR ENG53 citations91
US6541871B2Apr 1, 2003
Method for fabricating a stacked chip package
ADVANCED SEMICONDUCTOR ENG20 citations86
US7023079B2Apr 4, 2006
Stacked semiconductor chip package
ADVANCED SEMICONDUCTOR ENG12 citations83