Inventor
SHIH CHENG-HUNG
TW28 patents
⚠️ This page may combine multiple inventors who share the name “SHIH CHENG-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
8 patentsUS12224734B2Feb 11, 2025
Surface acoustic wave device and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations60
US11522517B2Dec 6, 2022
Surface acoustic wave device and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations60
US10797213B2Oct 6, 2020
Chip package and chip thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US11148864B1Oct 19, 2021
Storage container for electronic devices
CHIPBOND TECHNOLOGY CORP0 citations43
US11056555B2Jul 6, 2021
Semiconductor device having 3D inductor and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations43
US8877629B2Nov 4, 2014
Semiconductor manufacturing process and structure thereof
CHIPBOND TECHNOLOGY CORP0 citations36
US9230823B1Jan 5, 2016
Method of photoresist strip
CHIPBOND TECHNOLOGY CORP0 citations33
US10808331B2Oct 20, 2020
Electroplating system and pressure device thereof
CHIPBOND TECHNOLOGY CORP0 citations29
SHIH CHENG-HUNG
7 patentsUS8501614B1Aug 6, 2013
Method for manufacturing fine-pitch bumps and structure thereof
SHIH CHENG-HUNG16 citations80
US8530344B1Sep 10, 2013
Method for manufacturing fine-pitch bumps and structure thereof
SHIH CHENG-HUNG5 citations69
US8497579B1Jul 30, 2013
Semiconductor packaging method and structure thereof
SHIH CHENG-HUNG4 citations57
US8581239B2Nov 12, 2013
Package structure and semiconductor structure thereof
SHIH CHENG-HUNG2 citations56
US8783897B2Jul 22, 2014
Lamp module with electronic connector adapter
SHIH CHENG-HUNG0 citations40
US8437142B2May 7, 2013
Bump structure and process of manufacturing the same
SHIH CHENG-HUNG0 citations38
US8330280B1Dec 11, 2012
Bump structure and process of manufacturing the same
SHIH CHENG-HUNG0 citations38
NAT CHUNG SHAN INST SCIENCE & TECH
3 patentsUS10144645B1Dec 4, 2018
Method for preparing spherical aluminum oxynitride powder
NAT CHUNG SHAN INST SCIENCE & TECH11 citations81
US10923621B2Feb 16, 2021
Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate
NAT CHUNG SHAN INST SCIENCE & TECH0 citations57
US10384941B2Aug 20, 2019
Method for producing spherical silicon nitride powder
NAT CHUNG SHAN INST SCIENCE & TECH0 citations50
UNIV NAT SUN YAT SEN
3 patentsUS9312440B2Apr 12, 2016
Epitaxy structure of a light emitting element having III-nitride quantum wells
UNIV NAT SUN YAT SEN0 citations48
US9147808B2Sep 29, 2015
III-nitride quantum well structure and a light-emitting unit using the same
UNIV NAT SUN YAT SEN0 citations48
US8916458B2Dec 23, 2014
III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the same
UNIV NAT SUN YAT SEN1 citations48